Thermal Processes

Thermal processing includes a diversity of processes where high temperatures are used. In device fabrication, annealing may be necessary to activate dopants after ion implantation or to alloy contacts after metal deposition, while treatment in a chemically active atmosphere is used to change the surface layer, e.g., by diffusion of dopants and thermal oxidation of a Si surface.

 NameModelManufacturerLab
DetailsCarbolite Tube furnaceunknownCarboliteKTHMaterial
DetailsCeramic hotplate C-MAG HP 10 IKAKTHMaterial
DetailsEntech Tube furnaceunknownEntechKTHMaterial
DetailsFurnaceHT17CarboliteKTHMaterial
DetailsHigh-temperature graphite furnace-Thermal Technology Inc.KTHMaterial
DetailsMetal bath Bi-SnunknownunknownKTHMaterial
DetailsNabertherm Muffle furnaceC19NaberthermKTHMaterial
DetailsOven with mechanical convection (240lt) FP 240BinderKTHMaterial
DetailsOven with mechanical convection (720lt) FP 720 BinderKTHMaterial
DetailsTemperature chamber PL115 ArcTestKTHMaterial
DetailsTube furnace 3unknownunknownKTHMaterial
DetailsTube furnace 4unknownunknownKTHMaterial
DetailsActivatorActivator 150 (SiC anneal)CentrothermElectrum
DetailsBake 5U 26MemmertElectrum
DetailsBertil7476E-79 Manual Wedge-Wedge Wire BonderWest Bond Electrum
DetailsPeoPEO-603 Anneal furnace III/V (ramp)PEOElectrum
DetailsRTA100 RTP SystemsMattsonElectrum
DetailsT1-Oxide 1250C5200ThermcoElectrum
DetailsT2-Oxide 1250C5200ThermcoElectrum
DetailsT3-Gate ox5200ThermcoElectrum
DetailsT4-FGA5200ThermcoElectrum
DetailsW0607Wet bench HF clean and HF dopedWet bench HF cleanElectrum
DetailsWetb-diff-cleanWet bench Clean and IMECWet bench CleanElectrum
DetailsYes-ugnPolyimide Bake Oven YES-450PB8-2/6-2YESElectrum
DetailsFurnaceLE 6/113/B150NaberthermGreenhouse
DetailsFurnaceLE 6/113/B150NaberthermGreenhouse
DetailsFurnaceLE 6/113/B150NaberthermGreenhouse


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