Dry Etching

 NameModelManufacturerResponsible group name
DetailsICPICP DRIE (Si, SiO2)STSQLA-Nanoteknik
DetailsP5000 RIE/PECVD clusterPrecision 5000 Mark II (Dielectric, MxP, CVD)Applied MaterialsEKT
DetailsEsaPlasmalab80Plus (Oxford RIE System) Chamber BOxford Plasma SystemQLA-Nanoteknik
DetailsFabioICP380 Etch SystemOxford InstrumentQLA-Nanoteknik
DetailsGallusICP380 Etch System (GaAs & InP)Oxford InstrumentQLA-Nanoteknik
DetailsTegalB300RF PlasmalineIRnova
DetailsTepla300 (Microwave Plasma Asher)TePlaQLA-Nanoteknik
DetailsRIERIE of thin films (Si3N4 & SiO2)Plasmalab System 100QLA-Nanoteknik
DetailsArielPlasmalab80Plus (Oxford RIE System)Oxford Plasma TechnologyQLA-Nanoteknik
DetailsOrbis, Vapor HF etchOrbis AlphamemsstarMST
DetailsMarianaRapierSPTSMST