Dry Etching

 NameModelManufacturerResponsible group name
DetailsALOESICP AOE (DRIE)STSMST
DetailsICPICP DRIE (Si, SiO2)STSNano-QLA
DetailsP5000Precision 5000 Mark II (Dielectric, MxP, CVD)Applied MaterialsEKT
DetailsEsaPlasmalab80Plus (Oxford RIE System) Chamber BOxford Plasma SystemNano-QLA
DetailsFabioICP380 Etch SystemOxford InstrumentNano-QLA
DetailsGallusICP380 Etch System (GaAs & InP)Oxford InstrumentNano-QLA
DetailsTepla300 (Microwave Plasma Asher)TePlaNano-QLA
DetailsPamela308PC (RF Plasma Asher)STS EKT
DetailsRIERIE of thin films (Si3N4 & SiO2)Plasmalab System 100Nano-QLA
DetailsCenturaCentura II (DPS & MxP)Applied MaterialsEKT
DetailsArielPlasmalab80Plus (Oxford RIE System)Oxford Plasma TechnologyNano-QLA
DetailsRIBEIonfab 300 plusOxford Instruments Plasma TechnologyHMA-TP