Device Mounting

 NameModelManufacturerResponsible group name
DetailsBonderCB8 Substrate BonderKarl SussNano-QLA
DetailsOrthodyne20 Large WirebonderOrthodyneNano-QLA
DetailsRakelRakelDage Precima InternationalNano-QLA
DetailsFilippaAutomatic Flip Chip Bonder FC150SussMicrotecNano-QLA
DetailsBertil7476E-79 Manual Wedge-Wedge Wire BonderWest Bond Nano-QLA
DetailsBall bonder5410F&K Delvotec Semiconductor GmbHNano-QLA